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dc.contributor.authorDybedal, Joacim
dc.contributor.authorAalerud, Atle
dc.contributor.authorHovland, Geir
dc.date.accessioned2020-03-25T10:13:26Z
dc.date.available2020-03-25T10:13:26Z
dc.date.created2019-03-08T11:08:50Z
dc.date.issued2019
dc.identifier.citationDybedal, J., Aalerud, A. & Hovland, G. (2019). Embedded Processing and Compression of 3D Sensor Data for Large Scale Industrial Environments. Sensors, 3. doi:en_US
dc.identifier.issn1424-8220
dc.identifier.urihttps://hdl.handle.net/11250/2648520
dc.description.abstractThis paper presents a scalable embedded solution for processing and transferring 3D point cloud data. Sensors based on the time-of-flight principle generate data which are processed on a local embedded computer and compressed using an octree-based scheme. The compressed data is transferred to a central node where the individual point clouds from several nodes are decompressed and filtered based on a novel method for generating intensity values for sensors which do not natively produce such a value. The paper presents experimental results from a relatively large industrial robot cell with an approximate size of 10 m × 10 m × 4 m. The main advantage of processing point cloud data locally on the nodes is scalability. The proposed solution could, with a dedicated Gigabit Ethernet local network, be scaled up to approximately 440 sensor nodes, only limited by the processing power of the central node that is receiving the compressed data from the local nodes. A compression ratio of 40.5 was obtained when compressing a point cloud stream from a single Microsoft Kinect V2 sensor using an octree resolution of 4 cm.en_US
dc.language.isoengen_US
dc.publisherMDPIen_US
dc.relation.urihttps://doi.org/10.3390/s19030636
dc.rightsNavngivelse 4.0 Internasjonal*
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/deed.no*
dc.titleEmbedded Processing and Compression of 3D Sensor Data for Large Scale Industrial Environmentsen_US
dc.typePeer revieweden_US
dc.typeJournal articleen_US
dc.description.versionpublishedVersionen_US
dc.rights.holder© 2019 The Author(s)en_US
dc.subject.nsiVDP::Teknologi: 500en_US
dc.source.volume19en_US
dc.source.journalSensorsen_US
dc.source.issue3en_US
dc.identifier.doi10.3390/s19030636
dc.identifier.cristin1683226
dc.relation.projectNorges forskningsråd: 237896en_US
cristin.qualitycode1


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